What's Happening
At AdTech

AdTech Ceramics, a leading producer of high temperature co-fire ceramic electronic packages and technical ceramic components, announces the promotion of David Vernetti to Chief Operating Officer.

During David's brief tenure as the Director of Operations, he has exhibited stellar leadership and team building skills and has a unwavering determination for continual improvement. Mr. Vernetti has over 25 years of experience in the ceramics industry, including 10 years working with multilayer products, has a Masters Degree in Ceramic Engineering and an MBA. Mr. Vernetti has previously led teams to develop additional revenue streams by analyzing market needs and assessing manufacturing capabilities. He has also created and implemented an ISO9001 registered system and has developed long-term capital budgets and strategies.

Mr. Vernetti's successful employment history includes roles with increasing responsibility and impact culminating in leadership positions and overall operational accountability.

AdTech Ceramics, a leading manufacturer of high temperature co-fire ceramic electronic packages and precision ceramic components, continues to invest in equipment and technology to meet increasingly complex and demanding high reliability packaging requirements. The most recent addition is an ENEPIG plating line that complements AdTech's existing CVD, electroless and electrolytic plating capabilities.

AdTech Ceramics, a leading manufacturer of high temperature co-fire ceramic (HTCC) electronic packages, announces the addition of a copper thick film (CuTF) product line to complement its established multilayer product offerings. Possessing a uniquely impressive combination of high thermal conductivity and high electrical conductivity, copper films fired onto multilayer ceramic substrates open up the possibilities for designers who are challenged with heat removal, miniaturization of devices and cost. AdTech's standard ceramic offerings include aluminum oxide (Al2O3) and aluminum nitride (AlN). When high heat transfer is desired, aluminum nitride is preferred with thermal conductivity approximately 8 times that of alumina. Another benefit of CuTF is the precision of metal features. Since the copper is screened onto the ceramic surface, width and spacing of patterns can be significantly smaller when compared to the direct bond copper (DBC) process. AdTech also offers numerous plating options including; electroless and electrolytic Ni and Au and ENEPIG plating...

Ceramic packaging continues to evolve and maintain pace with advancing microelectronics technology, and remains the standard for many applications. High Temperature Co-fired Ceramics (HTCC) are an enabling subset of these technologies, established in the 1960s to provide hermetic, compact, reliable interconnect solutions. Microelectronics are now integrated in nearly every aspect of society, and the performance expectations have intensified. HTCC manufacturing technologies have maintained pace to provide enabling, cost effective solutions for leading-edge technologies including LEDs, power electronics, piezo and optoelectronics, medical advancements, photonics and sensors. Multilayer ceramics continue to be selected to meet miniaturization, heat removal, RF shielding, microwave performance, mechanical stability, high temperature, hermetic, premium reliability standards and cost requirements for emerging technologies.