The best ceramics
yield the best results.

MULTILAYER ALUMINUM NITRIDE (AlN)

AdTech Ceramics is the leading manufacturer of custom designed multilayer aluminum nitride substrates. Aluminum nitride offers high thermal conductivity with an excellent coefficient of thermal expansion (CTE) match to silicon. The material system is stable from cryogenic to high temperatures making it ideal for imaging applications as well as high power amplifier multichip modules and heater applications.

Using patented hot press technology, AdTech Ceramics is able to offer multilayer MCM substrates up to 4.5" (114.3mm) square with hermetic via positional tolerances of +/- .15%. Flatness can be held within .0002" (5um) and additional mechanical features can be machined using diamond and/or ultrasonic tools. Surface metal is applied using industry standard photolithography and etching techniques providing a variety of metallization options to meet application requirements. Design assistance and HFSS simulation is available for high frequency applications. Please see below for additional material specifications and download the Design and Capabilities Guideline for layout specific design rules.

  • Multilayer AlN products

Material Properties & Specifications

Color
Translucent Gray
Density
3.62 g/cc (0.118 #/cu. in.)
Hardness
1207 kg/mm 2 (Knoop)
Flexural Strength
280 MPa (40 psi x 10 3 )
Youngs Modulus
340 GPa (49 psi x 10 6 )
Shear Modulus
140 GPa (20 psi x 10 6 )
Surface Finish
<0.76 µm (<30 µ") standard
Thermal Expansion (25-300°C)
4.00 10 -6 /ºC (2.2 10 -6 /ºF)
Thermal Expansion (25-500°C)
4.50 10 -6 /ºC (2.5 10 -6 /ºF)
Thermal Conductivity (25°C)
160 W/mK (1174 BTU-in/ft2-h- ºF)
Dielectric Strength
13.0 kv/mm (330 volts/mil)
Volume Resistivity
>10 14 ohm-cm 2/cm
Dielectric Constant (1MHz)
8.6(Extrapolated Calculation)
Dielectric Constant (10 GHz)
8.2
Dissipation Factor (1 MHz)
0.0001
Metallization Options
  • Tungsten
  • Tungsten-Moly
Metallization Resistances
  • Buried: .015-.020 ohm/sq
  • Surface .005 ohm/sq (Gold Plated)
Brazed Component Materials
  • Alloy 194
  • Alloy 42
  • Copper Alloy
  • Copper Tungsten
  • Kovar
  • Molybdenum
Production Volumes
Prototype to High Production
Acceptable File Formats
  • DWG
  • DXF
  • Gerber Plot Data (RS274, RS274X) Barco PDF
  • IGES
  • STEP

Surface Metal Specifications

Types of Surface Metal
Gold (Au) Copper (Cu) Silver (Ag) Indium (In) Gold/Tin (AuSn) and others
Types of Barrier Metals
Nickel (Ni) Platinum (Pt) Molybdenum (Mo) and others
Seed Layers
Titanium/Tungsten (TiW)

Additional Information

Applications
  • Focal plane array substrates
  • Heater
  • Multi-Chip Modules (MCM)
  • Multilayer hermetic PWB
Industries Served
  • High Frequency/High Temperature Electronics
  • High Reliability Industrial/Commercial
  • Medical
  • Military
  • Optoelectronics
  • Telecommunications
Certifications
  • DFARS 252.225-7014 (Alternate 1) Compliant
  • ISO 9001:2008 Certified
  • AS9100C Certified
  • ITAR Compliant
  • MIL-I-45208
  • RoHS Directive Compliant
Software Used
  • AutoCAD®
  • Autodesk®
  • Autodesk® Inventor™
  • CAM 350
  • Gerber Plot
  • SolidWorks®
Design Files
  • DWG
  • DXF
  • Gerber Plot
  • IGS
  • IPC-D-356(A)
  • PDF
  • STEP