MULTILAYER ALUMINUM NITRIDE (AlN)
AdTech Ceramics is the leading manufacturer of custom designed multilayer aluminum nitride substrates. Aluminum nitride offers high thermal conductivity with an excellent coefficient of thermal expansion (CTE) match to silicon. The material system is stable from cryogenic to high temperatures making it ideal for imaging applications as well as high power amplifier multichip modules and heater applications.
Using patented hot press technology, AdTech Ceramics is able to offer multilayer MCM substrates up to 4.5" (114.3mm) square with hermetic via positional tolerances of +/- .15%. Flatness can be held within .0002" (5um) and additional mechanical features can be machined using diamond and/or ultrasonic tools. Surface metal is applied using industry standard photolithography and etching techniques providing a variety of metallization options to meet application requirements.
Please see below for additional material specifications and download the Design and Capabilities Guideline for layout specific design rules.
- Multilayer AlN products
Material Properties & Specifications
- Color
- Translucent Gray
- Density
- 3.62 g/cc (0.118 #/cu. in.)
- Hardness
- 1207 kg/mm 2 (Knoop)
- Flexural Strength
- 280 MPa (40 psi x 10 3 )
- Youngs Modulus
- 340 GPa (49 psi x 10 6 )
- Shear Modulus
- 140 GPa (20 psi x 10 6 )
- Surface Finish
- <0.76 µm (<30 µ") standard
- Thermal Expansion (25-300°C)
- 4.00 10 -6 /ºC (2.2 10 -6 /ºF)
- Thermal Expansion (25-500°C)
- 4.50 10 -6 /ºC (2.5 10 -6 /ºF)
- Thermal Conductivity (25°C)
- 160 W/mK (1174 BTU-in/ft2-h- ºF)
- Dielectric Strength
- 13.0 kv/mm (330 volts/mil)
- Volume Resistivity
- >10 14 ohm-cm 2/cm
- Dielectric Constant (1MHz)
- 8.6(Extrapolated Calculation)
- Dielectric Constant (10 GHz)
- 8.2
- Dissipation Factor (1 MHz)
- 0.0001
- Brazed Component Materials
-
- Alloy 194
- Alloy 42
- Copper Alloy
- Copper Tungsten
- Kovar
- Molybdenum
- Production Volumes
- Prototype to High Production
Surface Metal Specifications
- Types of Surface Metal
- Gold (Au) Copper (Cu) Silver (Ag) Indium (In) Gold/Tin (AuSn) and others
- Types of Barrier Metals
- Nickel (Ni) Platinum (Pt) Molybdenum (Mo) and others
- Seed Layers
- Titanium/Tungsten (TiW)
Additional Information
- Applications
-
- Focal plane array substrates
- Heater
- Multi-Chip Modules (MCM)
- Multilayer hermetic PWB
- Industries Served
-
- High Frequency/High Temperature Electronics
- High Reliability Industrial/Commercial
- Medical
- Military
- Optoelectronics
- Telecommunications
- Certifications
-
- DFARS 252.225-7014 (Alternate 1) Compliant
- ISO 9001:2008 Certified
- AS9100C Certified
- ITAR Compliant
- MIL-I-45208
- RoHS Directive Compliant
- Software Used
-
- AutoCAD®
- Autodesk®
- Autodesk® Inventor™
- CAM 350
- Gerber Plot
- SolidWorks®
- Design Files
-
- DWG
- DXF
- Gerber Plot
- IGS
- IPC-D-356(A)
- STEP