Home
Materials
Products
Design
Contact Us
Area Reps
Map
Lodging

Ceramic Materials 

Ceramics are used to produce packages that are used with active and passive electronic components such as chips, resistors, capacitors, sensors and other critical devices. These devices are used in automotive electronics, telecommunications, medical, computers, and a huge variety of electronic instruments and consumer appliances.

Alumina (92% Al2O3))  White or Black Ceramic is the most popular ceramic material for multilayer packages.  It offers high strength, good thermal conductivity, hermeticity, excellent electrical properties and the lowest cost high density interconnect.  

Aluminum Nitride (AlN) Due to its high thermal conductivity ( 160 W/mK) and excellent Thermal Coefficient of expansion match to Silicon, AlN is the ceramic material of choice for high heat dissipation and/or large chip applications.  

Metallization  Top

Metallizations are largely dictated by the ceramic base material.  Alumina and Aluminum Nitride require refractory metals such as Tungsten (W) and Molybdenum (Mo) for high temperature sintering in protective atmospheres. 

Plating   Top

Ceramic Packages are typically supplied with Gold over Nickel plating on the metalized areas, and can have metal components attached by brazing.  AdTech offers electrolytic and electroless Nickel and Gold in a range of thicknesses.  

Brazed Components   Top

Kovar and Alloy 42 are the most popular metals for brazed components due to their good thermal coefficient of expansion match to ceramics and relatively low cost.  Molybdenum and Copper Tungsten are also available. 

Low Temperature Co-fire Ceramics 

(LTCC) - Multiple glass ceramic materials available with buried resistors

AdTech standard processes utilize Dupont tape and ink systems; custom applications can be manufactured using all major LTCC systems
MATERIAL PROPERTIES
  • Standard Layer Thicknesses: .0038" (.10mm); .0055" (.14mm); .0085" (.22mm)
  • Dielectric Constant: 7.8 @ 1MHz
  • Coefficient of Thermal Expansion: 5.8 PPM
  • Volume Resistivity: 1 x 1012 @ 100 VDC
  • Camber: .003"/inch (.08mm/mm)
  • Thermal Conductivity: 3.0 W/mK
INTERCONNECTS*
  • Filled Via
    • Typical Diameter: .010" (.25mm)
    • Cover Pad Diameter (internal): Via Dia + .002" (.05mm)
    • Cover Pad Diameter (external): Via Dia + .005" (.13mm)
    • Via-to-Via Centerline: .025" (.64mm)
    • Via-to-Edge Centerline: w=t+v (web = thickness + via diameter)
  • Internal Metal Circuit
    • Typical Width: .008" (.2mm)
    • Typical Space between Circuits: .008" (.2mm)
    • Typical Space from Edge: .030" (.76mm)
  • Surface Metal Circuit
    • Typical Width: .008" (.2mm)
    • Typical Space between Circuits: .008" (.2mm)
    • Typical Space from Edge: .010" (.25mm)
  • Relation to Vias
    • Isolation Gap from Cover Pad to Metal Plane: .015" (.38mm)
    • Circuit to Cover Pads: .010" (.25mm)

* Please consult with AdTech for custom options.
METALLIZATION
  • Surface - Silver or Gold
  • Internal - Silver
BURIED RESISTORS
  • Tolerance: +/- 20%

Chemical Milling

In addition to ceramic products, AdTech makes and supplies high quality chemically milled products in Kovar, Alloy 42, Stainless and Spring Steel.  Products include step lids, lead frames, seal rings and other applications.  Products can be supplied as etched, or with Ni/Au plating for seam welding applications.

Top