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<Back Structural Parameters | Vertical Interconnects | Horizontal Interconnects | Detailed PDF Version
Design
considerations for multilayer ceramic packages can be grouped into these
categories:
|
|
Features |
Description |
Alumina |
Aluminum
Nitride |
|
Length/Width
(X/Y) |
Standard
Tolerances |
±1%
NLT ±0.13mm ±(.005") |
±.005" |
|
|
Special
Tolerances |
±.5% |
(Sawed)
± 0.05mm (.002") |
|
Layer
Thickness (A) |
Standard |
0.18mm
(.007") to 0.64mm (.025") |
0.13mm
(.005") |
|
|
Special |
0.13mm
(.005") to 0.76mm (.030") |
0.09mm (.0035") to 0.38mm (.015") |
|
|
Standard
Tolerances |
±10% |
±10% |
|
|
Special
Tolerances |
±5% |
n/a |
|
Package Thickness (Z) |
Range
|
0.25mm
(.010") - 8.89mm (.350") |
3.4mm
(0.135")max |
|
|
Standard Tolerances |
±10%
|
±0.08mm
(.003") |
|
|
Special Tolerances |
±5%
|
±0.03mm
(.001") |
|
Flatness |
Standard
|
0.08mm/mm
(.003"/inch) |
0.03mm/mm
(.001")/inch |
|
|
Special (Machined) |
0.03mm/mm
(.001"/inch) |
n/a |
|
Surface Finish |
As
Fired |
<1.14µm
(45µ") |
n/a |
|
|
Lapped |
<0.51µm
(20µ") |
<0.64µm(25µ") |
|
|
Polished |
n/a
|
<0.13µm(5µ") |
The
basic interconnect between layers
metallized edge castellations and flat edge metallization. Generally, via
diameters should be at least the thickness of
the ceramic layer and via pitch 2.5 times the layer thickness. Vias may require
a cover pad to be
interconnect pattern to assure optimal electrical
|
Feature
|
Description |
Alumina
|
Aluminum
Nitride |
|
Filled Via (B) |
Diameter
Range |
0.10mm
(.004") - 0.51mm (.020") |
0.13mm
(.005") - 0.51mm (.020") |
|
(C) |
Cover
Pad dia (Internal) |
Via
dia + 0.05mm (.002") |
Via
DIA+0.05mm (.002") |
|
(C) |
Cover
Pad dia (External) |
Via
dia + 0.13mm (.005") |
Via
DIA+0.38mm (.015")* |
|
(D) |
Via-to-Via
Centerline |
0.30mm
(.012") Min. |
0.38mm
(.015") Min. |
|
(R) |
Via-to-Edge
(Standard) |
w
= t + v (web = thickness + via diameter) |
0.25mm
(.010") |
|
|
Via-to-Edge
(Sawed Edge) |
0.20mm
(.008") Internal Via |
0.20mm
(.008") Internal Via |
|
|
Via-to-Edge
(Sawed Edge) |
0.00
Split Via (see page 10) |
n/a |
|
Bore Coated Via (Q) |
Diameter
Range |
0.30mm
(.012") - 0.64mm (.025") |
n/a |
|
|
Cover Pad Diameter |
Hole
dia + 0.25mm (.010") |
n/a |
|
(P) |
Castellation
Radius (Typical) |
0.20mm
(.008") |
n/a |
|
Edge Metallization (L) |
Centerline |
0.64mm
(.025")Min. |
n/a |
|
(J) |
Circuit
Neckdown (Range) |
0.13mm
(.005") to Width of Edge Metal |
n/a |
|
(K) |
Pullback
From Edge |
0.51mm
(.020") (TYP) 0.25mm (.010") Min. |
n/a |
Horizontal Interconnects
Circuit
layout is usually a compromise between maximizing conductor trace width to
minimize resistance, and maximizing
the space between conductors, and other metal features such as vias, in order to
minimize yield losses. It is desirable to pull
back buried metal features from the ceramic edge, and neck down conductors that
terminate with edge metallization. Internal
ground planes should be limited
|
Feature
|
Description |
Alumina
|
Aluminum
Nitride (AIN) |
|
Internal Metal Circuit
(F) |
Typical
Width |
0.15mm
(.006") - 0.25mm (.010") |
0.15mm
(.006”) - 0.25mm (.010") |
|
|
Custom Width |
0.10mm
(.004") |
0.10mm
(.004") |
|
(G) |
Typical
Space |
0.15mm
(.006") - 0.25mm (.010") |
0.15mm
(.006”) - 0.25mm (.010") |
|
|
Custom Space |
0.13mm
(.005") |
0.13mm
(.005") |
|
|
Maximum Coverage |
85% |
75% |
|
|
Recommended Grid |
Equal
lines and spaces |
Equal
lines and spaces |
|
(I) |
Typical Space from Edge |
0.76mm
(.030") |
0.254mm
(.010") |
|
|
Custom Space from Edge (Sawed) |
0.13mm
(.005") |
0.20mm
(.008") |
|
Surface
Metal Circuit (F) |
Typical Width |
0.20mm
(.008") |
0.20mm
(.008")* |
|
|
Custom Width |
0.10mm (.004") |
0.10mm
(.004")* |
|
(G) |
Typical Space |
0.20mm
(.008") |
0.20mm
(.008")* |
|
|
Custom Space |
0.13mm
(.005") |
0.10mm
(.004")* |
|
|
Maximum Coverage |
100% |
100% |
|
(E) |
Typical Space from Edge |
0.25mm
(.010") |
0.254mm
(.010")* |
|
|
Custom Space from Edge |
0.00mm
(.000") |
0.18mm
(.007")* |
|
Relation
to Vias (M) |
Isolation Ring Around Cover Pad |
0.38mm
(.015") |
0.20mm
(.008")* |
|
|
Custom Isolation Ring |
0.25mm
(.010") |
0.10mm
(.004")* |
|
(N) |
Circuit to Cover Pad |
0.25mm
(.010") |
0.20mm
(.008")* |
|
|
Custom Space (External) |
0.15mm
(.006") |
0.10mm
(.004")* |
|
|
Custom Space (Internal) |
0.20mm
(.008") |
0.20mm
(.008")* |
|
|
